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●The product FD-6011 is a one-component epoxy adhesive which cures rapidly after heating. Its shear thinning viscosity and low hygroscopicity make it very suitable for high-speed SMT screen printing and coating, and has a good controllable glue point shape. ●The product FD-6021 (SMT) is a one-component epoxy adhesive which cures rapidly after heating. Its excellent thixotropic properties and air-free state make it very suitable for dispensing in high-speed SMT mounting machine, and it has good shape control of the dispensing point.
Typical uses： ●The product can be used to bond the patch elements to PCB before wave soldering. The low hygroscopicity of FD-6011 enables it to be exposed to open storage tanks for a long time without affecting the coating performance or causing holes in cured adhesives. ●FD-6021（SMT）Especially suitable for medium and high speed dispensing, high glue shape, high strength, good electrical performance occasions. |
